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Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader

机译：导热接合材料，半导体封装，散热器，半导体芯片以及将半导体芯片接合至散热器的接合方法

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摘要

A heat conductive bonding material 6 has a first bonding region 7 transferring heat of a semiconductor chip 1 to a heat spreader 4, and a second bonding region 8 relaxing a thermal stress generated between the semiconductor chip 1 and the heat spreader 4.

机译：导热接合材料6具有将半导体芯片 1 的热量传递到散热器 4 的第一接合区域 7 和第二接合区域 8 缓和了在半导体芯片 1 和散热器 4之间产生的热应力。 展开▼

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公开/公告号US2007228530A1

专利类型

公开/公告日2007-10-04

原文格式PDF

申请/专利权人 TOSHIHISA SATO;KENJI FUKUZONO;MASATERU KOIDE;
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申请/专利号US20060544630

发明设计人 TOSHIHISA SATO;KENJI FUKUZONO;MASATERU KOIDE;
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申请日2006-10-10

分类号H01L23/495;

国家 US

入库时间 2022-08-21 21:04:46

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