首页> 外国专利> L-shaped heat spreader of thermally conductive material encapsulated in metal for connection between electronic package and heat sink

L-shaped heat spreader of thermally conductive material encapsulated in metal for connection between electronic package and heat sink

机译:封装在金属中的导热材料的L形散热器,用于电子封装和散热器之间的连接

摘要

An electronic package (10) designed to be mounted in a space vehicle includes active electronic components that produce heat energy during operation and has a shear plate (12) attached to a heat sink (13) or heat pipe (14). A heat spreader (11) includes an L-shaped plate, preferably of thermal pyrolitic graphite encapsulated in aluminum, which has a long arm (20) attached to the shear plate (12) by a heat conductive adhesive and a short arm (21) attached to the heat sink (13) for transferring heat energy from the package (10) to the heat sink (13). The heat sink (13) and the package (10) produce a dynamic load and the heat sink (13) and the package (10) are designed to carry the dynamic load with the heat spreader (11) providing only thermal enhancement.
机译:一种设计为安装在航天器中的电子封装(10),包括在运行过程中会产生热能的有源电子组件,并具有连接至散热器(13)或热管(14)的剪切板(12)。散热器(11)包括L形板,该L形板优选地由封装在铝中的热解热石墨制成,该L形板具有通过导热粘合剂附接到剪切板(12)的长臂(20)和短臂(21)。附连到散热器(13)以将热能从封装(10)传递到散热器(13)。散热器(13)和封装(10)产生动载荷,并且散热器(13)和封装(10)设计成通过散热器(11)承载动载荷,散热器(11)仅提供热增强。

著录项

  • 公开/公告号GB2356288A

    专利类型

  • 公开/公告日2001-05-16

    原文格式PDF

  • 申请/专利权人 * MOTOROLA INC;

    申请/专利号GB20000017402

  • 发明设计人 THOMAS R * MESSENGER;IAN MARK * WHITING;

    申请日2000-07-14

  • 分类号H01L23/367;H01L23/373;H01L23/40;

  • 国家 GB

  • 入库时间 2022-08-22 01:05:17

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