Optimal heat transfer of heat sink design based on electronic package thermal distribution using COMSOL package software

摘要

Due to the advanced development in semiconductor technology, the size of electronic component and devices become smaller while the performance becomes significantly greater. The increased of power density in the system causes the system components to either operate at higher temperature which led to thermal problem. This thermal problem will reduce the performance and efficiency of the electronics package. The most popular device used for electronic cooling is heat sink. In order to improve the heat transfer process, various type of heat sink with different shapes, materials and dimensions have been designed. This study aims to provide the optimal heat transfer of heat sink to minimize electronic package thermal distribution. This study only focuses on circular and square types of pin fin heat sink with various arrangements. In this study, COMSOL Multiphysics software will be used to simulate various pin fins arrangement design of the heat sink model. The results have proposed a new arrangement of the pin fin that able to give better thermal performances which are 4.1% and 0.5% for circular type and 0.2% and 0.4% for square type compared to inline and staggered arrangement.