Reliability of Anisotropic Electrically Conductive Adhesive Attachments on Flexible PI Substrates under Harsh Conditions

摘要

Anisotropic electrically conductive films (ACF) are commonly used in high density applications with flexible polyimide (PI) substrates. They are also used increasingly under demanding conditions. To study the reliability of ACF interconnections with PI substrates, an ACF was used to attach two different silicon chips on flexible PI substrate. The reliability of the ACF interconnections was investigated by exposing the test samples to three environmental conditions: thermal cycling from -40°C to 125°C, high humidity and high temperature at 85°C/85% relative humidity (RH), and corrosive humid environment with salt. The results of the three tests showed that the ACF interconnections on the PI substrates were indeed reliable in the thermal cycling and high humidity tests. However, the corrosive environment of the salt spray test caused several failures.