Environmental Impact of High Density Interconnect Printed Boards as a Function of Design Parameters

摘要

The paper describes a modeling tool developed to evaluate environmental impact of both HDI and conventional PWB fabrication processes. It includes impact of energy, water, and process chemicals. It also factors energy generation source based on manufacturing locale. Several product emulators will be used to demonstrate how the modeling tool can be used to assess impact of interconnect design alternatives. Results include Global Warming Potential (GWP) Impact vs Board Area for various designs and PWB technologies.