High density interconnect-multi layered printed circuit board, has upper and lower board layers with conducting layers, where total surface of conducting layer of upper layer is larger than total surface of conducting layer of lower layer

摘要

The board (1) has upper and lower printed circuit board (PCB) layers comprising heat conducting layers (6-11) attached on an electrically insulating base material. Vertical interconnect accesses (vias) (3, 4, 5) extend perpendicular to the PCB layers in Z-direction. The conducting layers connect the PCB layers such that the vias and the conducting layers form a heat conducting bridge from an upper PCB layer to a lower PCB layer. Total surface of the heat conducting layer of upper PCB layer is larger than a total surface of heat conducting layer of lower PCB layer.