Mechanical characterization of nanoparticle enhanced Sn-3.0Ag-0.5Cu solder

摘要

Solder plays an important role as interconnect in the electronics assembly, which provide the necessary electrical, mechanical and thermal continuity. In recent years, miniaturization of the portable products demands better solder-joint performance and conventional solder technology can not guarantee device reliability. The particle reinforced solder alloy is considered as the potentially available method to enhance the solder joints. The particle size should be small enough to hinder the grain boundary sliding and suppress the growth of intermetallic compound. Nanocomposite solders are regarded as one of the most promising interconnect materials for the high density electronic packaging due to their high mechanical strength and fine microstructure. However, the developments of nanocomposite solders have been limited by the inadequate compatibility between nanoparticles and solder matrix with respect to density, hardness, coefficient of thermal expansion, and surface activity. In order to solve this problem, carbon nanotube (CNT) was selected as reinforcement materials in Sn-3.0Ag-0.5Cu solder in this work. The effect of the nanoparticle on void content of solder bump was studied. The microstructure and shear strength of nanosocomposite solders were also investigated.