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Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

机译：纳米复合囊烷烃：添加Ni和Ni-Sn纳米粒子对Sn-3.0Ag-0.5Cu焊料的形态和力学性能的影响

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A. Yakymovych; P. Švec; L. Orovcik; O. Bajana; H. Ipser;
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1. Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders [J] . Yakymovych A., Svec P. Sr., Orovcik L., Journal of Electronic Materials . 2018,第1期

机译：纳米复合囊烷烃：添加Ni和Ni-Sn纳米粒子对Sn-3.0Ag-0.5Cu焊料的形态和力学性能的影响
2. Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles [J] . Yakymovych Andriy S., Plevachuk Yu O., Švec Petr, Journal of materials science . 2017,第15期

机译：纳米复合SAC焊料：通过添加Co纳米粒子，Sn-3.8Ag-0.7Cu焊料的形貌，电学和机械性能
3. Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range [J] . A. Yakymovych, Yu. Plevachuk, V. Sklyarchuk, Journal of Phase Equilibria and Diffusion . 2017,第3期

机译：Sn-3.0Ag-0.5Cu纳米复合焊料加固Ni纳米粒子的微观结构和电物理性质在熔化 - 凝固温度范围内加固Ni纳米粒子
4. Effect of Sb and Ni Addition on Microstructure and Mechanical Properties of SAC1205 Solder [C] . Yibo Wang, Jicun Lu, Ming Li, International Conference on Electronic Packaging Technology . 2020

机译：Sb和Ni的添加对SAC1205焊料组织和力学性能的影响
5. Orientation distribution, morphology, and size distribution of copper-tin intermetallic compound in reactions between molten solder and copper in flip chip solder joints. [D] . Suh, Jongook. 2006

机译：倒装芯片焊点中熔融焊料与铜之间的反应中铜锡金属间化合物的方向分布，形态和尺寸分布。
6. Suppressed Growth of (Fe Cr Co Ni Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging [O] . Yu-An Shen, Chun-Ming Lin, Jiahui Li, -1

机译：固态时效期间Sn-3.0Ag-0.5Cu焊料与FeCoNiCrCu0.5衬底之间的界面处（FeCrCoNiCu）Sn2金属间化合物的生长受到抑制
7. Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8Ag–0.7Cu solders by adding Co nanoparticles [O] . 2017

机译：纳米复合SAC焊料：通过添加Co纳米颗粒，Sn–3.8Ag–0.7Cu焊料的形貌，电气和机械性能

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

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