首页> 外文会议>International Conference on Advances in Materials and Manufacturing Processes >The Design of Three-dimensional Vibration Sensor Based On SOI Microfabbrication
【24h】

The Design of Three-dimensional Vibration Sensor Based On SOI Microfabbrication

机译:基于SOI微造建的三维振动传感器设计

获取原文

摘要

Compared with the traditional vibration sensors, the micro-vibration sensor have many advantages, such as small size, high sensitivity and low noise which is based on micro-fabbrication. This paper introduced the micro-vibration sensors which sensitive structure are cilium and micro-elastic beams. The micro-vibration sensors were produced by the inductively coupled plasma technology (ICP), the maximal etching depth of which can be greater than 300μm, the thickness of beam is less than 20μm and the longth of cilium are more than 3000μm. The sensitivity of the sensor is 102.5μV/g, the measurement range to ±20g, and the resonant frequency is 2KHz.
机译:与传统的振动传感器相比,微振动传感器具有许多优点,例如小尺寸,高灵敏度和基于微型制造的低噪声。本文介绍了敏感结构是纤毛和微弹束的微振动传感器。通过电感耦合等离子体技术(ICP)产生微振动传感器,其最大蚀刻深度可以大于300μm,梁的厚度小于20μm,纤毛的叶片大于3000μm。传感器的灵敏度为102.5μV/ g,测量范围为±20g,谐振频率为2kHz。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号