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Effect of annealing temperatures on the micro-structure of CuInS_2 thin film by one-step electrodeposition

机译:用一步电沉积对CUINS_2薄膜微结构的退火温度的影响

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CuInS_2 thin film used for photovoltaic applications was prepared by one-step electrodeposition. The films were annealed at different temperatures of 350, 400, 500°C. Effects of annealing temperatures on the properties of the film were investigated by the way of X-ray diffraction (XRD), scanning electron microscopy (SEM) and UV-Vis-NIR Spectroscopy. The result shows that CuInS_2 film with chalcopyrite structure can be successfully prepared by one-step electrodeposition. Annealing is effective in improving the crystallinity of the thin film. The temperature of 400°C is favorable to the grain growth of the film without the generation of impurity.
机译:通过一步电沉积制备用于光伏应用的Cuins_2薄膜。将薄膜在350,400,500℃的不同温度下退火。通过X射线衍射(XRD),扫描电子显微镜(SEM)和UV-Vis-Nir光谱研究了退火温度对膜性能的影响。结果表明,通过一步电沉积可以成功地制备Cuins_2薄膜。退火在改善薄膜的结晶度方面是有效的。 400℃的温度有利于薄膜的晶粒生长而不会产生杂质。

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