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Impact of electron-phonon transport on the thermal resistance of metal-nonmetal interfaces

机译:电子 - 声子输送对金属 - 非金属界面热阻的影响

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In this work, we study the impact of the phonon thermal conductivity of Silver (Ag) and Gold (Au) on the interface resistance of metal-nonmetal contacts at room temperature. The thermal conductivity of both metals is determined for bulk and thin films of varying thickness using non-equilibrium molecular dynamics (NEMD) simulations. Likewise, we determine the thermal interface resistance due to phonons of metal films embedded in a nonmetal layer composed of Silicon (Si). Based on a two-temperature model (TTM) for electrons and phonons, we determine the thermal resistance due to electron-phonon interactions and the variation of the film resistance of Ag and Au layers as a function of their thickness. The latter considering the estimated phonon contribution to the thermal conductivity of the studied metals obtained with our NEMD simulations. Two important results are presented in this work. First, we have found for the studied metals that at room temperature phonons contribute less than 1.0 % to the bulk thermal conductivity; and that their relative contribution to the conductivity and its variation with the film thickness significantly impacts the overall film resistance of metallic films.
机译:在这项工作中,我们研究了银(Ag)和金(Au)对室温金属 - 非金属触点界面电阻的影响。使用非平衡分子动力学(NEMD)模拟,确定两种金属的导热率为不同厚度的块状和薄膜。同样地,我们确定由于嵌入于由硅(Si)组成的非金属层中的金属膜的声子而导致的热界面电阻。基于用于电子和声子的两个温度模型(TTM),我们确定由于电子 - 声子相互作用引起的热阻和Ag和Au层的膜电阻的变化作为其厚度。后者考虑到估计的声子对通过我们的NEMD模拟获得的研究金属的导热率的贡献。这项工作提出了两个重要成果。首先,我们已经找到了研究的金属,在室温声子上贡献大于1.0%的散热导热;并且它们对电导率的相对贡献及其膜厚度的变化显着影响了金属膜的整体膜阻力。

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