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Impact of electron-phonon transport on the thermal resistance of metal-nonmetal interfaces

机译:电子声子传输对金属-非金属界面热阻的影响

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In this work, we study the impact of the phonon thermal conductivity of Silver (Ag) and Gold (Au) on the interface resistance of metal-nonmetal contacts at room temperature. The thermal conductivity of both metals is determined for bulk and thin films of varying thickness using non-equilibrium molecular dynamics (NEMD) simulations. Likewise, we determine the thermal interface resistance due to phonons of metal films embedded in a nonmetal layer composed of Silicon (Si). Based on a two-temperature model (TTM) for electrons and phonons, we determine the thermal resistance due to electron-phonon interactions and the variation of the film resistance of Ag and Au layers as a function of their thickness. The latter considering the estimated phonon contribution to the thermal conductivity of the studied metals obtained with our NEMD simulations. Two important results are presented in this work. First, we have found for the studied metals that at room temperature phonons contribute less than 1.0 % to the bulk thermal conductivity; and that their relative contribution to the conductivity and its variation with the film thickness significantly impacts the overall film resistance of metallic films.
机译:在这项工作中,我们研究了室温下银(Ag)和金(Au)的声子热导率对金属-非金属触​​点的界面电阻的影响。使用非平衡分子动力学(NEMD)模拟可确定厚度变化的块状和薄膜的两种金属的导热系数。同样,我们确定由于嵌入在由硅(Si)组成的非金属层中的金属膜的声子所引起的热界面电阻。基于电子和声子的双温度模型(TTM),我们确定了由于电子-声子相互作用而引起的热阻以及Ag和Au层的膜电阻随厚度变化的变化。后者考虑了通过我们的NEMD模拟获得的估计的声子对所研究金属的热导率的贡献。这项工作提出了两个重要的结果。首先,对于所研究的金属,我们发现在室温下,声子对整体热导率的贡献小于1.0%。并且它们对电导率的相对影响及其随膜厚的变化会显着影响金属膜的整体膜电阻。

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