Lead-free Nanosilver Die-attach Material for Making High-temperature Double-side Cooled Power Modules - (PPT)

摘要

As the LTJT by silver sintering is actively being pursued for manufacturing power modules to improve reliability in higher T_j applications, the nanosilver paste material or nanotech has the advantage of reducing the cost of implementing LTJT for making planar, double-side cooled power modules because it requires simpler tooling and less costly substrates and results in higher yield.