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Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for PCBs - (PPT)

机译:等离子体沉积以提供新型表面饰面和PCBS的保护涂层 - (PPT)

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1) You need to review your product's needs first to choose the proper surface finish. There is "no single finish that fits all": Consulting with your (OEM, CM-EMS is key). 2) Observation: US market tends to favor ImmAg (larger and thicker bds); EU tends to favor ImmSn (smaller and thinner boards); Handheld prefer OSP/ENIG (combi-finish); OSP are used in all product application areas.
机译:1)您需要首先审核您的产品需求,以选择适当的表面光洁度。有“无人终止,适合所有人”:与您的(OEM,CM-EMS是关键)的咨询。 2)观察:美国市场往往有利于Impag(较大且BDS较厚);欧盟倾向于有利于immsn(较小和更薄的板);手持式更喜欢OSP / ENIG(Combi-Finish); OSP用于所有产品应用领域。

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