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SRAM Memory Cell Leakage Reduction Design Techniques in 65 nm Low Power PD-SOI CMOS

机译:SRAM存储器电池泄漏减少设计技术65 nm低功耗PD-SOI CMOS

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Whereas below 65 nm, Igidl and I_G become as important as ISTH in BULK technology, in PD-SOI technology ISTh is still the dominant current due to the floating body. Thereby, to overcome the leakage problem in PD-SOI, the main parameters to address are the body voltages of the cell transistors. It has been shown that the best results are obtained when letting the bit lines floating (FBL) and increasing the cell ground voltage (UVSS) or reducing the cell supply voltage (LVDD). Leakage reduction up to 80% is achieved.
机译:虽然低于65nm,但Igidl和i_g在批量技术中变得同样重要,但在PD-SOI技术中,ISTH仍然是由于浮体引起的主流电流。由此,为了克服PD-SOI中的泄漏问题,地址的主要参数是单元晶体管的主体电压。已经表明,当允许位线浮动(FBL)并增加电池地电压(UVS)或减少电池电源电压(LVDD)时,获得了最佳结果。实现泄漏降低80%。

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