首页> 外文会议>Symposium on electrodeposition of nanoengineered materials and devices 3 >High Perpendicular Coercivity Electroless Cobalt Alloy Films with 25 nm Thicknesses
【24h】

High Perpendicular Coercivity Electroless Cobalt Alloy Films with 25 nm Thicknesses

机译:高垂直矫顽力电镀钴合金薄膜,厚度为25nm

获取原文

摘要

Magnetic films that are uniform and less than 50 nm thick are required for various applications, such as micro electro mechanical systems (MEMSs) and magnetic recording systems (1-3). In addition, a specific application, magnetic force microscopy (MFM) probes requires thin magnetic films which are used to show magnetization states at the microscopic level (4). For obtaining such thin films with uniform thickness, an electrochemical deposition process is ideal. We fabricated bit patterned media (BPM) using electrochemical methods. For instance, we used electron beam lithography (EBL) and applied electroless deposition and electrodeposition to form BPM (5, 6). We also form BPM using nanoimprint lithography with UV curable resin or spin on glass (6, 7). In both case, CoPt was electrodeposited. In this study, we focused on the electroless deposition process. By using electroless deposition, we can obtain conformal deposition of metals with uniform structure in large area without consideration for distribution of current density.
机译:各种应用需要均匀且小于50nm厚的磁性膜,例如微电器机械系统(MEMS)和磁记录系统(1-3)。另外,特定应用,磁力显微镜(MFM)探针需要薄的磁性薄膜,其用于在微观级别(4)处显示磁化状态。为了获得具有均匀厚度的这种薄膜,电化学沉积过程是理想的。我们使用电化学方法制作位图案化介质(BPM)。例如,我们使用电子束光刻(EBL)并涂布无电沉积和电沉积来形成BPM(5,6)。我们还使用纳米压印光刻形成BPM,含有UV可固化树脂或旋转玻璃(6,7)。在这两种情况下,COPT被电沉积。在这项研究中,我们专注于无电沉积过程。通过使用无电沉积,我们可以在大面积内具有均匀结构的金属的保形沉积,而不考虑电流密度的分布。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号