METHOD FOR FORMING A COBALT ALLOY BASED MULTI-LAYERED DIFFUSION BARRIER THROUGH ELECTROLESS PLATING WITH TWO KINDS OF COBALT ALLOY THIN FILMS HAVING DIFFERENT COMPOSITIONS

摘要

PURPOSE: A method for forming a cobalt alloy based multi-layered diffusion barrier through electroless plating is provided to improve oxidation resistance of copper wires and to minimize damages of the wires by improving properties between the copper wires and the diffusion barrier.;CONSTITUTION: A method for forming a cobalt alloy based multi-layered diffusion barrier through electroless plating comprises a step for performing an electroless plating process on the surface of copper layers and a step for successively forming the cobalt alloy based multi-layered diffusion barrier having different compositions. The bottom layer of the diffusion barrier is formed to the cobalt alloy based multi-layered diffusion barrier. The cobalt alloy based multi-layered diffusion barrier has good resistance comparing to the resistance of electromigration of the copper wires.;COPYRIGHT KIPO 2010