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Structural and Piezoresistive Characteristics of Amorphous Silicon Carbide Films Grown on AlN/Si Substrates

机译:ALN / Si衬底上生长的非晶碳化硅膜的结构和压阻性特性

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Amorphous silicon carbide (a-SiC) thin films have been grown on aluminum nitride (AlN) intermediate layers on (100) Si substrates by RF magnetron sputtering technique. Profilometry, four-point probe method, Rutherford backscattering spectroscopy (RBS) and Fourier transform infrared (FTIR) were employed to characterize the as-deposited SiC thin films. Test structures have been developed to investigate the piezoresistive properties. These structures consist of SiC thin-film resistors on AlN/Si substrates defined by reactive ion etching (RIE) with Ti/Au pads formed by lift-off process. Gauge factor (GF) and temperature coefficient of resistance (TCR) measurements have been performed and demonstrated the potential of these resistors to be used as sensing elements in devices for high temperature application.
机译:通过RF磁控溅射技术在(100)Si基板上的氮化物(ALN)中间层上生长了非晶碳化硅(A-SiC)薄膜。采用了Fulilemerry,四点探针方法,Rutherford反向散射光谱(RB)和傅立叶变换红外(FTIR)来表征沉积的SiC薄膜。已经开发了测试结构以研究压阻性质。这些结构包括在通过通过剥离工艺形成的Ti / Au焊盘而定义的ALN / Si基板上的SiC薄膜电阻器。已经进行了仪表系数(GF)和温度的电阻系数(TCR)测量并证明了这些电阻器的电位用作高温施加的装置中的传感元件。

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