首页> 外文会议>International Conference on Manufacturing Science and Engineering >The Analysis of Temperature Field and Residual Stress Distribution during H-beam Cooling Process
【24h】

The Analysis of Temperature Field and Residual Stress Distribution during H-beam Cooling Process

机译:H梁冷却过程中温度场和残余应力分布的分析

获取原文

摘要

A spot-test of cooling after the finish-rolling was performed for the typical H-beam and the temperature field during the process and residual stress in the beams after the cooling were measured. By using finite element method, the cooling temperature-field of the H700×300 H-beam was simulated and the thermal stress distribution formed in this process was calculated by using thermo-mechanical coupling function. The simulation results matched well with the data obtained on the spot. The accurate description performed in this paper for the temperature field and residual stress distribution of H-beam during cooling process is especially helpful to the manufacture plant. According to the results the reasonable technical parameters can be constituted to control the temperature of the beam in the cooling process and reduce the residual stress in the final product.
机译:在测量冷却后,对典型的H梁和温度场进行典型H梁和温度场进行典型H梁和温度场的透射率测试。通过使用有限元方法,模拟H700×300 H梁的冷却温度场,并通过使用热机械耦合功能计算在该过程中形成的热应力分布。模拟结果匹配良好,目前获得的数据良好。在冷却过程中,本文在本文中进行的准确描述对于H梁的温度场和H型梁的残余应力分布对制造设备特别有利。根据结果​​,可以构成合理的技术参数以控制冷却过程中光束的温度,并降低最终产品中的残余应力。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号