Resistance microwelding of Au/Ni-plated phosphor bronze sheet to insulated Cu wire have been investigated using mechanical testing, optical microscopy, scanning electron microscopy, and energy-dispersive X-ray spectroscopy. The results show that mechanisms of joint formation involve solid-state bonding with Au and Cu atoms diffusion at low welding current, a combination of brazing and solid-state bonding at high welding current. Due to the hindrance of Ni plating which has a higher melting temperature and hardness, the joint breaking force is smaller than that without plating.
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