Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement

摘要

Noise suppression and power integrity (PI) are two requirements for power/ground layers of printed circuit boards (PCBs). We have proposed the application of electromagnetic bandgap (EBG) structure and ferrite film to power/ground layers. In this paper, not only a test board with the proposed structure but three other test boards to be compared were fabricated to measure with a vector network analyzer. The measured data was evaluated for noise-suppression and PI characteristics. Additional evaluation using a commercial circuit simulator was carried out to evaluate noise-suppression and PI characteristics, assuming a real power-supply circuit. Through the evaluation, the test boards with ferrite film including the proposed structure provided sufficient results.