EBG AN ON-CHIP ELECTROMAGNETIC BANDGAP EBG STRUCTURE FOR NOISE SUPPRESSION

摘要

An integrated circuit (IC) die for electromagnetic band gap (EBG) noise suppression is provided. A power mesh and a ground mesh are laminated in a back end of line (BEOL) region on the semiconductor substrate, and the inductor is arranged on the power and ground meshes. The inductors are stacked one on top of the other and include a plurality of inductor segments that are connected together to define the length of the inductor. The capacitor is under the power and ground meshes and is connected in series with the inductor. The respective terminals of the capacitor and the inductor are coupled to the power and ground meshes, respectively. Also provided is a method for manufacturing an IC die.;