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ZnO- and TiO_2-based semiconductor films prepared by plasma enhanced CVD without any carrier gas

机译:基于ZnO-和TiO_2的半导体膜由等离子体增强的CVD制备,没有任何载气

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Plasma enhanced chemical vapor deposition (PECVD), one of the most widely used techniques in modern microelectronics, is firstly employed to prepare ferromagnetic ZnO-based and TiO_2-based magnetic semiconductors at low deposition temperature without any carrier gas. ZnO-based films show excellent photoluminescence at room temperature. All doped oxide films show room-temperature ferromagnetic behaviors by using superconducting quantum interference device measurements. Magnetic ions incorporating into host lattice and the exclusion of secondary phase in films are confirmed by microstructure analysis and magnetic results, such as XRD, XPS, PL and FC/ZFC. In order to gain insights into the effect of oxygen vacancies or nitrogen implantation on ferromagnetism of oxide-based semiconductors, all films were annealed in N_2 ambience at 900°C or treated in NH_3 or O_2 plasma at 350°C. The results indicated the crucial role of hole-carriers or oxygen-vacancies playing in the ferromagnetic coupling between magnetic ions in oxide-based semiconductors.
机译:等离子体增强化学气相沉积(PECVD)是现代微电子中最广泛使用的技术之一,首先用于在不带任何载气的低沉积温度下制备铁磁性ZnO基和TiO_2的磁半导体。基于ZnO的薄膜在室温下显示出优异的光致发光。所有掺杂的氧化物膜通过使用超导量子干涉装置测量来显示室温铁磁行为。通过微结构分析和磁性结果证实了包含在宿主晶格中的磁离子和膜中的二次相排除,例如XRD,XPS,PL和Fc / ZFC。为了进入氧气空位或氮气注入对基于氧化物的半导体的铁磁体的效果,所有薄膜在900℃下在N_2氛围中退火,或在350℃下在NH_3或O_2等离子体中处理。结果表明了孔 - 载体或氧气空位在氧化物基半导体中磁离子之间的铁磁耦合的氧气耦合的关键作用。

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