3D integration and challenges for advanced RF and microwave systems: EDA perspective

摘要

Heterogeneous integration delivers “the best junction for the function” to achieve the highest performance by utilizing a known good die strategy. However as technology emerges with more complex systems, die-package co-design becomes a mandatory aspect in the design phase to mitigate risk and foresee results before the entire system is built. Various aspects of such design is reviewed in this work with a focus on advanced RF and microwave systems.