High energy physics experiments at future particle accelerators set very demanding requirements on the performance of sensors and readout electronics. In these applications, silicon pixel detectors have to integrate advanced functionalities in the pixel cell itself, such as amplification, filtering, discrimination, time stamping, zero suppression and analog-to-digital conversion. This paper discusses how 3D vertical integration has the potential of providing a performance breakthrough in particle detection systems, and how the high energy physics community is organizing itself to meet the challenges of designing and fabricating vertically integrated devices.
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