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Effect of palladium addition on nickel silicide formation on Si (111)

机译:钯添加对Si(111)镍硅化物形成的影响

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In this work, the influence of palladium addition on phase transition, surface morphology, structural, vibrational, and electrical properties of nickel silicide is investigated at various temperatures. For Ni(Pd)Si films micro-Raman measurements have yielded Raman phonon peaks belonging to NiSi phase, although redshifted, on par with new peaks at 322 and 434 cm~(-1), not determined before, which we assign to the compositional disorder, introduced by Pd. The results have shown that Ni(Pd)Si films are thermally stable up to 900 °C, which is 100-150 °C more than that for pure NiSi films. Applying Miedema's model we have calculated the heat of formation for Ni(Pd)Si and found it to be more negative than that for pure NiSi, revealing a key role of Pd in the retardation of NiSi_2 phase formation. AFM results have shown that the presence of Pd favorably influences the surface morphology of NiSi, resulting in a smoother surface. Furthermore, we have discussed the impact of annealing conditions on peculiarities of Pd diffusion, element distribution and electrical properties of Ni(Pd)Si and NiSi films.
机译:在这项工作中,在各种温度下研究了钯添加对镍硅化镍的相转变,表面形态,结构,振动和电性能的影响。对于NI(PD)Si薄膜微拉曼测量结果已经产生了属于NISI相的拉曼峰值,尽管红移,但在322和434cm〜(-1)的新峰面上,我们以前未确定,我们分配给组成PD引入的疾病。结果表明,Ni(Pd)Si膜热稳定,高达900℃,比纯NISI薄膜多100-150°C。应用Miedema的模型我们已经计算了Ni(Pd)Si的形成热量,发现它比纯NISI更负,揭示了Pd在NISI_2相形成的延迟中的关键作用。 AFM结果表明,PD的存在有利地影响NISI的表面形态,导致更平滑的表面。此外,我们讨论了退火条件对Ni(Pd)Si和NISI膜的Pd扩散,元素分布和电性能的影响。

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