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Experiment and Device Simulation for Photo-Electron OverflowCharacteristics on a Pixel-Shared CMOS Image SensorUsing Lateral Overflow Gate

机译:使用横向溢出栅极的像素共享CMOS图像传感器光电溢流特性的实验与装置仿真

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A wide dynamic range CMOS image sensor with lateral overflow integration capacitor sharing two pixels by using lateral overflow gate (LO-gate) which directly connect the photodiode and the overflow photoelectron integration capacitor (Cs) has been developed. In this paper, the characteristics of the saturated-photoelectrons overflowing to the floating diffusion (FD) and to the Cs have been discussed through the comparison of the results of experiments and device simulations. It is possible to integrate all the saturated photoelectrons in the Cs without leaking to the shared FD by controlling the voltages of the gate electrodes of the transfer transistor and the LO-gate in the pixel which strong light irradiates. The CMOS image sensor consisting of 1/3.3 inch optical format, 3 μm pixel pitch and 1280~((H)) x 960~((v)) pixels was fabricated by a 0.18 μm 2P3M CMOS technology with a buried pinned photodiode process and has achieved 84 μV/e~- photo-electric conversion gain, 6.9 x 10~4 e~- full well capacity and 90 dB dynamic range in one exposure.
机译:通过使用直接连接光电二极管的横向溢流栅极(LO门)和溢出光电子集成电容(CS),具有横向溢流积分电容的宽动态范围CMOS图像传感器。在本文中,已经通过比较实验和器件模拟结果来讨论溢流的饱和光电子的特性和溢出的浮动扩散(FD)和CS。可以通过控制传送晶体管的栅电极的电压和强光照射的像素中的栅电极的电压来集成CS中的所有饱和光电子而不泄漏到共享FD。由1/3.3英寸光学格式组成的CMOS图像传感器,3μm像素间距和1280〜((H))×960〜((v))像素由0.18μm2p3mcmos技术制成,具有掩埋的钉扎光电二极管工艺和已实现84μV/ E〜 - 光电转换增益,6.9 x 10〜4 e〜 - 全井容量和90 dB动态范围一次曝光。

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