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Side-Channel Leakage in Masked Circuits Caused by Higher-Order Circuit Effects

机译:由高阶电路效果引起的屏蔽电路的侧通道泄漏

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Hardware masking is a well-known countermeasure against Side-Channel Attacks (SCA). Like many other countermeasures, the side-channel resistance of masked circuits is susceptible to low-level circuit effects. However, no detailed analysis is available that explains how, and to what extent, these low-level circuit effects are causing side-channel leakage. Our first contribution is a unified and consistent analysis to explain how glitches and inter-wire capacitance cause side-channel leakage on masked hardware. Our second contribution is to show that inter-wire capacitance and glitches are causing side-channel leakage of comparable magnitude according to HSPICE simulations. Our third contribution is to confirm our analysis with a successful DPA-attack on a 90nm CMOS FPGA implementation of a glitch-free masked AES S-Box. According to existing literature, this circuit would be side-channel resistant, while according to our analysis and measurement, it shows side-channel leakage. Our conclusion is that circuit-level effects, not only glitches, present a practical concern for masking schemes.
机译:硬件掩蔽是针对侧通道攻击(SCA)的众所周知的对策。与许多其他对策一样,掩蔽电路的侧通道电阻易受低电平电路效应的影响。但是,没有详细分析,解释了如何以及在多大程度上,这些低级电路效应导致侧通道泄漏。我们的第一款贡献是统一和一致的分析,以解释故障和线间电容如何导致遮罩硬件上的侧通道泄漏。我们的第二次贡献是表明,根据HPHICE模拟,导线间电容和毛刺导致相当幅度的侧通道泄漏。我们的第三款贡献是通过成功的DPA攻击确认我们的分析,以90nm CMOS FPGA实现无故障蒙面的AES S盒。根据现有文献,该电路将是侧通道的抗性,而根据我们的分析和测量,它显示侧通道泄漏。我们的结论是,电路级效应不仅是故障,对掩蔽方案的实际关注呈现实际问题。

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