首页> 外文会议>International Conference on Processing Materials for Properties >ENHANCING MECHANICAL RESPONSE OF A 96.5Sn-3.0Ag-0.5Cu SOLDER USING ENERGY EFFICIENT MICROWAVE ASSISTED SINTERING ROUTE
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ENHANCING MECHANICAL RESPONSE OF A 96.5Sn-3.0Ag-0.5Cu SOLDER USING ENERGY EFFICIENT MICROWAVE ASSISTED SINTERING ROUTE

机译:使用节能微波辅助烧结途径增强96.5SN-3.0AG-0.5CU焊料的机械响应

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In the present study, the effects of conventional sintering and two-directional microwave assisted rapid sintering on the microstructure and tensile properties of a commercial lead-free solder (96.5Sn-3.0Ag-0.5Cu) are investigated. Conventional sintering was conducted on solder samples in an inert Argon atmosphere, whilst microwave sintering was carried out on the samples under ambient conditions. Two sintering temperatures of 150°Cand 210°C were investigated. Microwave sintered samples exhibited lower porosity and more refined matrix grain size. Tensile results of microwave sintered samples also revealed superior strength (0.2% YS and UTS) when compared to conventionally sintered samples. Furthermore, results showed that samples microwave sintered at 210°C yielded the best combination of mechanical properties.
机译:在本研究中,研究了常规烧结和双向微波辅助快速烧结对商业无铅焊料(96.5Sn-3.0Ag-0.5Cu)的微观结构和拉伸性能的快速烧结的影响。在惰性氩气氛中的焊料样品上进行常规烧结,而微波烧结在环境条件下在样品上进行。研究了150°CAND 210℃的两个烧结温度。微波烧结样品表现出较低的孔隙率和更精细的基质晶粒尺寸。与常规烧结样品相比,微波烧结样品的拉伸结果也揭示了优异的强度(0.2%YS和UTS)。此外,结果表明,在210℃下烧结的样品微波产生了机械性能的最佳组合。

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