Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route

摘要

This study compares the effects of conventional and microwave sintering on the densification, microstructure, and tensile properties of a lead-free solder, Sn-3.5Ag. Conventional sintering was carried out in an inert atmosphere while microwave sintering was performed under ambient conditions. Micro-structural characterization was carried out to investigate characteristics of grains, pores, and Ag_(3)Sn intermetallic compounds. Tensile characterization studies revealed that 0.2percent yield strength, ultimate tensile strength, and work of fracture were significantly increased by using microwave sintering.