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Optimized Fabrication Process of PZT Thin Film Capacitor for MMIC Applications

机译:MMIC应用PZT薄膜电容器的优化制造工艺

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This paper reports on the optimization of fabrication process of PZT thin film capacitor for monolithic microwave integrated circuit (MMIC) applications. PZT thin film is used as a dielectric in the capacitor design with the aim to achieve miniaturized structures. In this work, the fabrication processes involved are optimized including exposure parameter, etching composition and metallization. The results reported here show the feasibility of using this new material in MMICs. Typical capacitance values measured at microwave frequencies are presented here.
机译:本文报道了用于单片微波集成电路(MMIC)应用的PZT薄膜电容器的制造过程的优化。 PZT薄膜用作电容器设计中的电介质,其目的是实现小型化结构。在这项工作中,所涉及的制造过程经过优化,包括曝光参数,蚀刻组合物和金属化。此处报告的结果显示了在MMIC中使用这种新材料的可行性。这里介绍在微波频率下测量的典型电容值。

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