Investigation of thermomigration in composite SnPb solder joints

摘要

Due to the increasing functional demand and miniaturization in high-density microelectronics packaging, thermomigration in flip chip solder joints owing to Joule heating becomes a serious reliability issue. In recent years, a series of researches have been devoted to examining the failure mechanism of thermomigration in eutectic SnPb and lead-free solder joints. However, only a few studies were focused on the thermomigration phenomenon at room temperature. Also, the investigation of thermomigration in solder joints of commercial products was insufficient.