Thermomigration in flip-chip solder joints is investigated using alternating currents and infrared microscopy to decouple it from electromigration effect. It is found that the thermal gradient in solder bump can be as high as 2143℃/cm when 9.2 x 10~4 A/cm~(-2) was applied at 100℃. Markers fabricated by focus ion beam are employed to measure the thermomigration rate. The thermomigration flux is measufed to be 3.3 x 10~(13) at./cm~(-2). With the known thermal gradient, the molar heat of 26.8 kJ/mole has been obtained for the transport of Pb.
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机译：使用交流电和红外显微镜研究了倒装芯片焊点中的热迁移，以使其与电迁移效应分离。结果表明，在100℃下施加9.2 x 10〜4 A / cm〜（-2）时，焊料凸点的热梯度可高达2143℃/ cm。由聚焦离子束制造的标记物用于测量热迁移率。测得的热迁移通量为3.3×10 10（13 at.cm/cm 2）。在已知的热梯度下，已获得26.8 kJ / mol的摩尔热用于Pb的传输。
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