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A system-level equivalent circuit method for the electrical performance modeling of electronic packages

机译:一种用于电子包装电能建模的系统级等效电路方法

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In this paper, we propose a system-level field-circuit method for the signal integrity and power integrity simulation of power distribution networks inside the electronic packages. The electromagnetic field inside the power distribution network is expressed in the modal field distribution. The modal field is then decomposed into the parallel plate mode and transmission mode, which are related to the power-ground planes and signal traces respectively. Integral equations are created for these two modes. Through the discretization of the integral equations, network ports are defined between the power/ground planes and signal traces. In this way, their equivalent networks are extracted through the moments method solution of the integral equations. Finally, these two equivalent networks are combined together with the equivalent circuit of the through-hole via to provide the whole circuit model of the power distribution network. Through numerical examples, the accuracy and efficiency of the proposed method are verified.
机译:在本文中,我们提出了一种用于电子包装内部配电网络的信号完整性和功率完整性模拟的系统级视野电路方法。配电网络内的电磁场在模态场分布中表示。然后将模态场分解成并联板模式和传输模式,分别与功率接地平面和信号迹线相关。为这两种模式创建积分方程。通过积分方程的离散化,在电源/接地平面和信号迹线之间定义网络端口。以这种方式,通过积分方程的时刻方法解压缩它们的等效网络。最后,这两个等效网络与通孔通孔的等效电路组合在一起,以提供配电网络的整个电路模型。通过数值示例,验证了所提出的方法的准确性和效率。

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