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Effects of Conditioning Parameters on Pad Performances

机译:调节参数对垫性能的影响

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摘要

This paper studied the effects of the off-process conditioning parameters on the pad performances. The pad conditioning was evaluated based on the measurement of pad removal rate, the observation of the conditioned pad surface. The performances of conditioned pads were evaluated also by the material removal rate (MRR) and the surface roughness of polished wafers in the CMP experiments of LiTaO_3 crystal wafers.
机译:本文研究了脱机调节参数对垫性能的影响。基于焊盘去除速率的测量,检测调节垫表面的测量来评估焊盘调节。通过材料去除速率(MRR)评估了调节垫的性能,并在LiTaO_3晶晶片的CMP实验中的抛光晶片的表面粗糙度和抛光晶片的表面粗糙度。

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