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Study on electrical properties of HfTiON and HfTiO gate dielectric Ge MOS capacitors with wet-NO surface pretreatment

机译:湿法无表面预处理的备用和HFTIO栅电介质GE MOS电容器电性能研究

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Reactive co-sputtering is employed to prepare HfTiO/GeOxNy and HfTiON/GeOxNy stack gate dielectrics by using wet NO or N2O surface pretreatment. The experimental results show that the wet NO pretreatment can lead to excellent interface properties, gate leakage properties and device reliability, especially for HfTiON/GeOxNy stack gate dielectrics. The involved mechanisms lie in N-barrier role and suitable N incorporation in GeOxNy interlayer, effectively preventing further increase of GeOxNy interlayer and the growth of unstable GeOx during subsequent processing.
机译:采用反应性共溅射制备HFTIO / GEO X / ING> N Y 和HFTION / GEO X / ING> N Y 堆栈栅极电介质通过使用湿无或N2O表面预处理。实验结果表明,湿无预处理可导致优异的界面性能,闸门泄漏性能和装置可靠性,特别是对于HFTION / GEO X N Y 堆叠栅极电介质。涉及的机制位于N-Barrier作用和合适的N掺入Geo X / ING> N Y 中间层,有效地防止了GEO x N < INF> Y 中间层和不稳定地GEO X 在后续处理期间的增长。

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