首页> 外文期刊>Applied Physics A: Materials Science & Processing >Improved Electrical Properties Of Hftio/geo_xn_y Gate Dielectric Ge Mos Capacitors By Using Wet-no Ge-surface Pretreatment
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Improved Electrical Properties Of Hftio/geo_xn_y Gate Dielectric Ge Mos Capacitors By Using Wet-no Ge-surface Pretreatment

机译:湿法非Ge表面预处理改善了Hftio / geo_xn_y栅介电Ge Mos电容器的电性能

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摘要

Reactive cosputtering is employed to prepare high-permittivity HfTiO gate dielectric on n-Ge substrate. Effects of Ge-surface pretreatment on the interface and gate leakage properties of the dielectric are investigated. Excellent performances of Al/HfTiO/GeO_xN_y-Ge MOS capacitor with wet-NO surface pretreatment have been achieved with a interface-state density of 2.1 × 10~(11) eV~(-1) cm~(-2), equivalent oxide charge of -7.67 × 10~(11) cm~(-2) and gate leakage current density of 4.97 × 10~(-5) A/cm~2 at V_g = 1 V.
机译:反应共溅射用于在n-Ge衬底上制备高介电常数HfTiO栅极电介质。研究了Ge表面预处理对介电层的界面和栅漏特性的影响。采用湿式NO表面预处理的Al / HfTiO / GeO_xN_y / n-Ge MOS电容器具有出色的性能,其界面态密度为2.1×10〜(11)eV〜(-1)cm〜(-2),在V_g = 1 V时的等效氧化物电荷为-7.67×10〜(11)cm〜(-2),栅极泄漏电流密度为4.97×10〜(-5)A / cm〜2。

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