首页> 外文会议>International Conference on Integrated Power Electronics Systems Proceedings >Model for Power Cycling lifetime of IGBT Modules - various factors influencing lifetime
【24h】

Model for Power Cycling lifetime of IGBT Modules - various factors influencing lifetime

机译:电力循环寿命模型IGBT模块 - 影响寿命的各种因素

获取原文
获取外文期刊封面目录资料

摘要

A large number of power cycling data from different IGBT module generations and test conditions have been evaluated. Multiple regression with respect to the variables temperature swing ΔT{sub}J, T{sub}J, power-on-time (t{sub}(on)), chip thickness, bonding technology, diameter (D) of bonding wire, current per wire bond (I) and package type was performed. It provided parameters for a new empirical model describing number of power cycles (N{sub}f) in relation to these variables. For a fixed module technology and blocking voltage class, the set of variables have been restricted to ΔT{sub}J, T{sub}J, t{sub}(on) and I as the factors influencing the number of cycles to failure. The model is used to estimate the power cycling capability for the new generation of 1200V-IGBT4 Modules, which are rated up to a junction temperature of 150°C in operation.
机译:已经评估了来自不同IGBT模块代和测试条件的大量功率循环数据。关于变量温度摆动ΔT{Sub} J,T {Sub} J,接通时间(T {Sub}(ON)),芯片厚度,粘接线的直径(d),每根线键(I)和封装类型进行电流。它为描述了与这些变量相关的电源周期数(n {sub} f)的新实证模型提供了参数。对于固定模块技术和阻塞电压等级,该组变量被限制为Δt{sub} j,t {sub} j,t {sub}(开启),以及影响失败循环次数的因素。该模型用于估计新一代1200V-IGBT4模块的功率循环能力,其在操作中额定到150°C的结温。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号