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Coaxial Wiring Structures in Printed Circuit Boards

机译:印刷电路板中的同轴布线结构

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摘要

We have developed a printed circuit board (PCB) technology with coaxial wiring structures. The coaxial PCB was designed for a prototype model in order to verify the high frequency and high-speed signal transmission characteristics of the coaxial wiring, where high frequency low loss dielectric material was used as insulation layer. It was fabricated by buildup PCB process, additionally using NC end mill router to make a vertical shielding wall electrode. The high frequency measurement of the fabricated coaxial PCB was carried out by the time domain reflectometry (TDR) measurement and the time domain transmission (TDT) measurements. The characteristic impedances of the coaxial wiring lines were evaluated using a TDR waveform analyzer. The average characteristic impedance was controlled within 54 ?? ?± 3.7 %. The S-parameters were calculated from TDR/TDT measurement results. The insertion loss was measured to be less than 2.3 dB/cm at 10 GHz. Coaxial via structure was investigated for future multilayer coaxial PCB.
机译:我们开发了一种具有同轴布线结构的印刷电路板(PCB)技术。同轴PCB设计用于原型模型,以验证同轴布线的高频和高速信号传输特性,其中高频低损耗介电材料用作绝缘层。它通过Basualup PCB工艺制造,另外使用NC端研磨路由器制作垂直屏蔽壁电极。通过时域反射测量(TDR)测量和时域传输(TDT)测量来执行制造的同轴PCB的高频测量。使用TDR波形分析仪评估同轴线线的特征阻抗。平均特征阻抗在54中控制?±3.7%。 S参数由TDR / TDT测量结果计算。测量插入损耗在10GHz下测量小于2.3dB / cm。对未来多层同轴PCB研究了同轴通孔结构。

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