3D-MIDs are preferably injection molded structures including electrical circuits routed over a 3-dimensional surface. As shown in Fig. 1, a 3D-MID not only acts as a 3-dimensional circuit carrier but also may include functional features that can be created during the injection molding process. The combination of 3-dimensional circuits and functional features in one device offers new design capabilities complementing the standard 2-dimensional circuit board technology. 3D-MIDs are especially used in size critical applications such as cell phones or medical devices. Due to intensive research on 3D-MIDs especially the feature size of the metallization arrived in the fine pitch range. Today, 3D-MID circuit structures of less than 100 μm are used in mass production. However, due to a missing multilayer process, one limitation of the 3D-MID technology is the insufficient compatibility to related fine pitch semiconductor devices with a high I/O connection density. Therefore a new injection molding based multilayer process was developed and investigated.
展开▼
