TSV Process Integration for 3D-IC - (PPT)

摘要

3D-IC: vertically stacked die linked by through Si interconnect. Significant area of investment in the industry; Smallest form factor & greatest processing speed; IDM and packaging houses; TSV etch challenges subsequent metal processes; Via shape; Undercutting; "Scallops" from Bosch deep Si etch process; Successful TSV requires understanding of step-to-step interactions of processes.