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New conformal coating technology in SiP package for EMI shield - (PPT)

机译：EMI Shield的SIP包装新的保形涂层技术 - （PPT）

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New conformal shield technology by using spray process is competitive solution compared with current metal can and plating solution thanks to: 1. Compact size; 2. Minimum investment for production; 3. Simple process.

机译：通过使用喷涂过程的新保形屏蔽技术与电流罐和电镀解决方案相比，使用喷涂过程是竞争的解决方案：1。紧凑尺寸; 2.生产的最低投资; 3.简单的过程。

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《SMTA 3D/SiP Advanced Packaging Symposium 》|2008年||共45页
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SungSoon Park; IkSu Jun; DoWon Lee; YeSeul Ahn; DaeByoung Kang; JaeDong Kim; David Bolognia; Mike Kelly; Nozad Karim;
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中图分类 TN405-53;
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6. New conformal coating technology in SiP package for EMI shield - (PPT) [C] . SungSoon Park, IkSu Jun, DoWon Lee, SMTA 3D/SiP Advanced Packaging Symposium . 2008

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New conformal coating technology in SiP package for EMI shield - (PPT)

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