Thermomigration induced strain field simulation for microelectronics lead free solder joints-(PPT)

摘要

Due to temperature gradient, the mass will flow from the high temperature side to the low temperature side The vacancy flow will cause the mass accumulation at the cold side, The mass and vacancy accumulation progress with time, which will eventually lead to failure of nanoelectronics device. Temperature gradient is a serious reliability concern for nanoelectronics devices.