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Impact of Inert Atmosphere Quality on Wettability of Printed Wiring Board (PWB) Finishes for Surface Mount Soldering Applications-(PPT)

机译:惰性气氛质量对表面安装焊接应用的印刷线路板(PWB)润湿性的影响 - (PPT)

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摘要

An inert atmosphere quality of 1000 ppm O{sub}2 provides acceptable wetting characteristics applicable for reflow soldering processes using ENIG, immersion silver or immersion tin pwb surface finishes using a Sn63Pb37 solder alloy. An inert atmosphere quality of 100 ppm O{sub}2 provides acceptable wetting characteristics applicable for reflow soldering processes using ENIG, immersion silver or immersion tin pwb surface finishes using a SAC305 solder alloy.
机译:1000ppm o {sub} 2的惰性气氛质量提供可接受的润湿特性,可使用SN63PB37焊料合金进行使用Enig,浸入银或浸渍锡PWB表面饰面的回流焊接工艺。 100ppm O {Sub} 2的惰性气氛质量提供可接受的润湿特性,适用于使用SAC305焊料合金使用engig,浸入银或浸入式锡PWB表面饰面的回流焊接工艺。

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