QUANTIFYING CLEANING RELEVANCE WHEN MANUFACTURING LEAD-FREE PRINTED CIRCUIT BOARD ASSEMBLIES

摘要

Solder corrosion in the form of electrochemical migration has been studied and long known as a failure mechanism in electronic assemblies. Ionic contaminants, especially in the presence of moisture, increased power, whisker growths, and leakage currents, can lead to corrosion. The trend toward highly dense assemblies reduces the spacing between conductors while yielding a larger electronic field. As the industry moves to higher functionality, miniaturization, and lead-free soldering, studies show that cleanliness of the assembly becomes more important. The purpose of this research is to investigate cleaning relevance when manufacturing high reliable lead-free printed circuit board assemblies.