Strategies at the End of CMOS Scaling

摘要

Throughout the latter third of the 206 century Moore's Law has ruled the growthof the semiconductor industry. This astounding exponential growth at acompound rate of 40% per year over 40 years has been the product of higherpacking densities and larger chip sizes, where the higher packing densities havebeen achieved both by finer lithography patterning as well as by innovative self-aligned device structures. The non-lithographic contribution has been verysubstantial, since while feature sizes have been reduced by a factor of —102 duringthis time, circuit count has increased by a factor of —108. For the past decade orso, Moore's law has been codified as the SIA (Semiconductor IndustryAssociation) or, more recently, ITRS (International Technology Roadmap forSemiconductors) roadmaps. In these roadmaps, detailed goals are set forth, fromdevice structural parameters to system performance, for both memory and logic.For all of this time the silicon MOSFET has been the dominant device used inintegrated logic and memory chips, and for the past twenty years, complementaryMOS (CMOS) has been the dominant circuit type.