Demonstration of wafer capping through glass frit bonding and its application on molded platform package

摘要

This paper demonstrates the glass frit bonded cavity wafer capping fabrication process and its application on molding platform package. The fabrication process demonstrated from cavity wafer fabrication, glass frit print, wafer bonding and to the prototype on molded platform package. Two commercial glass frit materials were tested and studied. Detail process characterization of cavity wafer fabrication, glass frit fabrication, wafer bonding and molding process were carried on and discussed in this work. The demonstration in this paper shows the feasibility of capping MEMS package through glass frit for adapting to traditional molded platform package.