Carbon Nanotube Sheet Metal Matrix Composites as Die Attach Thermal Interface Materials - (PPT)

摘要

CNT TIM resistances did not decrease significantly as expected – Sputtering of Au does not decrease the intrinsic resistance of the CNT film. Annealing of Pd deposited films causes oxidation – Proved difficult to diffusion bond. Annealing of Au deposited films increases particle size – Increase in particle size does not necessarily decrease resistance. What is next? – What can wax do? – Development of a CNT film that will exploit the in plane thermal Conductivity; – Use Au deposition without annealing to diffusion bond die Attachment.