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REMARKABLE IMPROVEMENT IN CONTACT RESISTANCE PROPERTY OF THE Ag-Pd ALLOY WITH OXIDE FILM BY DOPING AGENTS

机译:通过掺杂剂与氧化物膜的Ag-Pd合金接触性的显着改善

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In order to improve contact resistance properties of the Ag-Pd alloy covered with contaminant films of oxide, Mg and Cr were used as additive dopants. For specimens of Ag(40wt%)-Pd(60wt%), Ag-Pd-Mg(0.1,0.5, and 1.0wt%), and Ag-Pd-Cr(0.1 and 0.5wt%), formation and elemental compositions of oxide films thermally grown on the surface were examined by using electron diffractometry, x-ray photoelectron spectrometry (XPS) and ellipsometry. And then effect of the oxide film on the contact resistance properties were clarified. The remarkable improvement of low contact resistance caused by the oxide film was found for Ag-Pd alloy with Mg dopant. However, for Cr dopant, the low contact resistance was not obtained in the same as Ag-Pd alloy itself. The mechanism of this improvement was clarified by analysis of the film formation and its elemental compositions. As the composition of the film formed on the Ag-Pd-Mg alloy, PdO, MgO, and Ag were identified. On the contrary, for Ag-Pd-Cr, Ag was not found excepting PdO, CrO, and Cr_2O_3. Moreover, for Pd-Ag, PdO was only found. Therefore, it concluded that the liberating Ag into the oxide film layer induced remarkable improvement of the low contact resistance properties of the Ag-Pd alloy with Mg dopant.
机译:为了改善涂覆氧化物污染膜覆盖的Ag-Pd合金的接触电阻性,Mg和Cr用作添加剂掺杂剂。对于银(40重量%)的试样 - 钯(60重量%),银 - 钯 - 镁(0.1,0.5,和1.0重量%),和银 - 钯 - 铬(0.1和0.5重量%),形成和元素组成通过使用电子衍射测定法,X射线光电子和椭圆形测定法检测在表面上热生长的氧化物膜。然后澄清了氧化膜对接触电阻性能的影响。用Mg掺杂剂发现由氧化膜引起的氧化膜引起的低接触电阻的显着提高。然而,对于Cr掺杂剂,不能与Ag-Pd合金本身相同的低接触电阻。通过分析膜形成及其元素组合物来阐明这种改进的机制。作为在Ag-Pd-Mg合金,PDO,MgO和Ag上形成的膜的组成。相反,除了PDO,CRO和CR_2O_3之外,没有发现AG-PD-CR,AG没有找到。此外,对于PD-AG,仅发现PDO。因此,它得出结论,将溶剂中的氧化物膜层诱导显着提高了镁掺杂剂的Ag-Pd合金的低接触电阻性能。

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