Study on Evaluation Method for the Heat Characteristics of IC Devices Based on the Combination of Orthogonal Experimental Method and Response Surface Method

摘要

In the thermal design of IC(integrated circuit) device, the traditional single varying parameter appraisal method for thermal analysis has ignored the mutual influence and interaction between parameters, without a multi-prameter synthetical design and optimization, now it does not meet the reality and design demand any longer that high density IC device works with the multi-parameter influence and interaction and high heat reliability. In this paper, with QFP(quad flat package) device taken as an example, the analysis method of the combination of the orthogonal experimental method and response surface method is applied to the analysis and evaluation for IC device heat characteristic. This one can take it into account roundly that some design parameters work commonly on the package heat performence of the IC device, sequentially bring the multi-parameter and synthetical optimization heat design into reality. So it is a perfect and applied method for the heat characteristic evaluation and heat design for IC component.